We are pleased to announce that Bett Sistemi is participating in the Pack Expo International 2018 exhibition, in Chicago, USA, the main event for technological innovation in the Packaging and Food&Beverage sectors of 2018.
Find the Bett Sistemi exhibition area at the Uppel Lakeside Hall - Stand E-7826, as you can see on the map below.
Pack Expo is one of the most important fairs dedicated to the packaging and processing sectors and this edition of Chicago is considered to be the most important of the two in terms of participation and quality of exhibiting companies. The United States continues to be a strong importer of technology and packaging machines. Here's where you find the Bett Sistemi Stand:
Fair site: https://www.packexpointernational.com/