From October 14th to 17th Bett Sistemi will be at the Fair in Chicago, USA, to take part in the Pack Expo International 2018 exhibition, the main and unmissable event for technological innovation in the Packaging and Food&Beverage sectors of 2018.
Event not to be missed to discover all the news that Bett Sistemi will exhibit in its space, which you will find at the Uppel Lakeside Hall - Stand E-7826, as indicated below.
Fair site: https://www.packexpointernational.com/